IEEE VR Workshop, March 24th, 2019
Osaka International Convention Center, Osaka, Japan

The latest wave of commodity virtual reality equipment has allowed unprecedented access to virtual experiences for consumers and researchers alike. Leading technology companies today are becoming increasingly invested in VR audio with new products, such as Facebook’s Spatial Workstation and Google’s Resonance Audio, that facilitate the use of advanced spatial audio techniques with popular game engines and digital audio workstations. However, most modern VR platforms impart an ancillary role to audio, where sounds serve to amplify visual immersion. As a result, audio remains an afterthought for many content developers and VR researchers despite its inherent role in immersion. It is therefore necessary to elaborate ways in which we can think natively about VR audio and articulate the role of sound in the ultimate displays of the future. In this workshop, we aim to not only highlight recent developments in VR audio, but also identify the needs of the VR community in creating compelling virtual auditory experiences for the next generation of immersive media. Accordingly, we seek submissions that address such topics as:

  • Best practices in VR audio
  • Creativity support tools for spatial audio
  • Analyses of new and existing authoring tools for VR audio
  • Audio-first and audio-only VRs
  • Virtual Interfaces for Musical Expression
  • Sonic Interaction Design for Virtual Environments (SIVE)
  • Acoustic modelling systems and techniques for VR
  • Auditory perception in virtual environments
  • VR audio and accessibility

    The workshop will feature paper presentations followed by demo sessions and a round table discussion. In addition to reports of completed research projects, the submissions can include position papers and late-breaking results. The length of the submissions can range from 2 to 5 pages based on the contribution. Paper presentations can be accompanied by demonstrations at the workshop. Proceedings of the workshop will be published in the IEEE Xplore Digital Library. Submissions should be prepared in IEEE Computer Society VGTC format (http://junctionpublishing.org/vgtc/Tasks/camera.html) and submitted as a PDF file via EasyChair at https://easychair.org/conferences/?conf=favr2019 by the submission deadline indicated below.

    The workshop website is located at http://favr2019.github.io. Inquiries about the workshop can be directed at the workshop organizers via the email addresses indicated below. For more information about IEEE VR 2019, please visit http://ieeevr.org/2019/.
    Submission Timeline
    Submissions due: January 25th, 2019

    Notification of acceptance: February 7th, 2019

    Camera-ready submission due: February 19th, 2019
    Workshop Schedule
    09:00 - 09:20 Welcome and Introductions
    Anıl Çamcı and Rob Hamilton
    09:20 - 09:40 Auditory spatial perception using bone conduction headphones along with fitted head related transfer functions
    Tray Minh Voong and Michael Oehler
    09:40 - 10:00 The Matter of Attention and Motivation – Understanding Unexpected Results from Auditory Localization Training using Augmented Reality
    Song Hui Chon and Sungyoung Kim
    10:00 - 10:20 Towards a Framework for Composition Design for Music-Led Virtual Reality Experiences
    Zach Buckley and Kristin Carlson
    10:20 - 10:40 Explorations in a Classroom Context of 3D Audio for Game Environments
    Greg Corness, Kristin Carlson and Zachary Buckley
    10:40 - 11:00 Audio Reproduction in Virtual Reality Cinemas
    Luke Reed and Philip Phelps
    11:00 - 11:20 Some Considerations on Creativity Support for VR Audio
    Anıl Çamcı
    11:20 - 11:40 Collaborative and Competitive Futures for Virtual Reality Music and Sound
    Rob Hamilton
    11:40 - 12:00 Astrolabe, a VR film and multimedia installation
    PerMagnus Lindborg
    12:00 - 13:00 Lunch Break
    13:00 - 14:00 Demo Sessions
    14:00 - 15:00 Group Discussion
    Workshop Leaders
    Anıl Çamcı, University of Michigan, acamci@umich.edu

    Rob Hamilton, Rensselaer Polytechnic Institute, hamilr4@rpi.edu